Qualcomm has announced that ASUS, HP and Lenovo are the first OEMs to develop mobile PCs powered by the Qualcomm® Snapdragon™ 835 Mobile PC Platform featuring the X16 LTE modem. 

Qualcomm has announced that ASUS, HP and Lenovo are the first OEMs to develop mobile PCs powered by the Qualcomm® Snapdragon™ 835 Mobile PC Platform featuring the X16 LTE modem. 

Each company is set to produce sleek, thin and fanless PCs running a Windows 10 experience with LTE connectivity for an always connected, on the go experience. Coupled with the 10nm leading node efficiency of the Snapdragon 835 Mobile PC Platform, these devices will feature beyond all-day battery life.

The Snapdragon 835 SoC built into the Mobile PC Platform features the Qualcomm® Kryo™ 280 CPU, Qualcomm® Adreno™ 540 GPU and Qualcomm® Hexagon™ 682 DSP, to manage separate heterogenous workloads.

According to Qualcomm , the Snapdragon 835 provides devices with superior thermal handling and greater power efficiency, enabling fanless designs with longer battery life, attributed to it being on the leading 10nm process node. With an integrated Snapdragon X16 Gigabit LTE modem, devices will be capable of peak download speeds of up to 1Gbps. The Snapdragon 835 Mobile PC Platform will also feature 802.11ac with 2×2 MU-MIMO for optimal Wi-Fi connectivity on the go.